Mfg Part Number: 9966-CDJX | Alternate P/N: 9966CDJX | NSN : 5962-01-332-0715 |
NIIN : 013320715 | CAGE Code : K0656 | Manufacturer: Bae Systems Operations Limited Dba Bae Systems Plc |
Item Name : Microcircuit Memory | FSC : 5962 Microcircuits Electronic |
Thank you for your vested interest in sourcing parts from Automatize Procurement. You have reached our NSN RFQ Page where you can submit quote requests on top-requested NSN 5962-01-332-0715 components, such as Microcircuit Memory manufactured by the manufacturer Bae Systems Operations Limited Dba Bae Systems Plc. Some of the items we have in stock and ready for purchase include part number 9966-CDJX, and various others, those of which have been thoroughly assessed for quality and reliability. At Automatize Procurement, we make it a priority to provide person-to-person communication at every stage of the fulfillment process, offering rapid lead times, unbeatable cost savings, and exceptional customer service.
Automatize Procurement prides itself in making quality the cornerstone of its operations, guaranteeing that our customers can trust in the integrity of our products. The NSN 5962-01-332-0715 products that we feature by Bae Systems Operations Limited Dba Bae Systems Plc are paired alongside their corresponding CAGE Code K0656. Additionally, the NSN items we carry are vetted for fit and function. If you find a part or component that suits your operations, we invite you to fill out and submit an RFQ form for your comparisons. For additional questions, you can call or email us directly; we are available 24/7x365!
NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
---|---|---|---|---|---|---|
5962-01-332-0715 Item Description: Microcircuit Memory | 5962 | 013320715 | 0 | N | B | |
CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
7 | B | A | 0 | |||
Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
9966-Cdjx | 2 | 2 | 3 |
MRC | Criteria | Characteristic |
---|---|---|
MEMORY | CZEQ | TIME RATING PER CHACTERISTIC55 00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME LOW TO HIGH LEVEL OUTPUT AND 55 00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME HIGH TO LOW LEVEL OUTPUT |
MEMORY | ADAQ | BODY LENGTH1 290 INCHES MAXIMUM |
MEMORY | CQSJ | INCLOSURE MATERIALCERAMIC |
MEMORY | CQWX | OUTPUT LOGIC FORMTRANSISTOR-TRANSISTOR LOGIC |
MEMORY | CQZP | INPUT CIRCUIT PATTERN14 INPUT |
MEMORY | ADAT | BODY WIDTH0 500 INCHES MINIMUM AND 0 610 INCHES MAXIMUM |
MEMORY | CBBL | FEATURES PROVIDEDHERMETICALLY SEALED AND BURN IN AND PROGRAMMABLE AND SCHOTTKY AND BIPOLAR |
MEMORY | TTQY | TERMINAL TYPE AND QUANTITY40 PRINTED CIRCUIT |
MEMORY | ADAU | BODY HEIGHT0 150 INCHES MINIMUM AND 0 210 INCHES MAXIMUM |
MEMORY | AEHX | MAXIMUM POWER DISSIPATION RATING1 0 WATTS |
MEMORY | AFGA | OPERATING TEMP RANGE-55 0125 0 DEG CELSIUS |
MEMORY | AFJQ | STORAGE TEMP RANGE-65 0150 0 DEG CELSIUS |
MEMORY | CQSZ | INCLOSURE CONFIGURATIONDUAL-IN-LINE |
MEMORY | CTFT | CASE OUTLINE SOURCE AND DESIGNATORD-3 MIL-M-38510 |
MEMORY | CWSG | TERMINAL SURFACE TREATMENTSOLDER |
MEMORY | CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC-0 5 VOLTS MINIMUM POWER SOURCE AND 18 0 VOLTS MAXIMUM POWER SOURCE |
MEMORY | CZER | MEMORY DEVICE TYPEROM |
MEMORY | TEST | TEST DATA DOCUMENT96906-MIL-STD-883 STANDARD INCLUDES INDUSTRY OR ASSOCIATION STANDARDS INDIVIDUAL MANUFACTUREER STANDARDS ETC |
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